- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
Patent holdings for IPC class H01L 23/50
Total number of patents in this class: 2005
10-year publication summary
233
|
207
|
155
|
216
|
215
|
179
|
141
|
144
|
124
|
51
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
163 |
Rohm Co., Ltd. | 5843 |
104 |
Intel Corporation | 45621 |
102 |
Mitsubishi Electric Corporation | 43934 |
72 |
Samsung Electronics Co., Ltd. | 131630 |
67 |
Renesas Electronics Corporation | 6305 |
59 |
Qualcomm Incorporated | 76576 |
52 |
International Business Machines Corporation | 60644 |
41 |
Denso Corporation | 23338 |
41 |
Boe Technology Group Co., Ltd. | 35384 |
37 |
Texas Instruments Incorporated | 19376 |
35 |
Micron Technology, Inc. | 24960 |
32 |
Murata Manufacturing Co., Ltd. | 22355 |
29 |
Fuji Electric Co., Ltd. | 4750 |
28 |
STATS ChipPAC Pte. Lte. | 1516 |
26 |
Monolithic 3D Inc. | 270 |
21 |
Infineon Technologies AG | 8189 |
19 |
Mediatek Inc. | 4584 |
18 |
Panasonic Corporation | 20786 |
17 |
SK Hynix Inc. | 11030 |
17 |
Other owners | 1025 |